
‘Solderless’
An Electronicstalk guide
Start with the news release LED socket suits wire and board applications from Tyco Electronics, which we summarised at the time by saying "Tyco Electronics has launched the Type CM solderless LED socket for easy integration of the Cree Xlamp MP-L multichip LED into light fixtures.". Several months prior to that, we featured the news release USBee Protolyzer for electronic design prototyping from CWAV: "CWAV has released the USBee Protolyzer, a dynamically configurable electronic prototyping platform with a range of analogue and digital test equipment in a single PC-connected device.".
In January 2010, we covered the news from ITT Interconnect Solutions - take a look at Universal contact provides vertical connection which says: "ITT Interconnect Solutions has launched a universal contact (UC) for angular alignment applications that provides a vertical electrical connection between a device and a PCB. ".
Take a look also at the news release from Aries Electronics, Kelvin test socket provides minimal signal loss, as well as Yokowo pogo pins reduce design size and weight from Yokowo America Corporation, and Aries CSP extends burn-in socket range from Aries Electronics.
Latest stories...
Aries test sockets have adjustable pressure pad (May 2009)
Aries Electronics is offering its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad.
Microchip unveils PICDEM lab development kit (March 2009)
Microchip has announced the PICDEM lab development kit, a comprehensive entry-level development platform for all Microchip's eight-bit Flash PIC microcontrollers (MCUs) with 20 or fewer pins.
Yokowo connector has small contact pitch (March 2009)
Yokowo has released a vertical cable connector with a contact pitch that measures 0.4mm.
Aries announces CSP/Ballnest hybrid socket (January 2009)
Aries Electronics has announced its CSP/Ballnest hybrid socket suitable for prototyping, test or burn-in of chip scale package, BGA (ball grid array), MicroBGA and LGA (land grid array) devices.
Aries releases compact test and burn-in sockets (November 2008)
Aries Electronics is offering its high frequency Center Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6.5mm squared with pitches down to 0.3mm.
Aries unveils centre probe test socket (October 2008)
Aries Electronics now offers a high-frequency centre probe test socket comprised of a standard moulded format that enables the socket to accommodate any device 6.5mm or smaller.
Aries updates test and burn-in and RF sockets (September 2008)
Aries Electronics has recently updated its CSP/BGA test and burn-in and RF sockets, including 13mm2, 27mm2, 40mm2 and 55mm2 models, to accommodate devices with pitches down to 0.3mm.
Low-profile test socket handles latest devices (August 2008)
Socket offers solderless pressure mount compression spring probes, which can be accurately located by two moulded plastic alignment pins and mounted with two stainless steel screws.
Further reading
- Zero profile solderless socket
Now available from Tyco Electronics, the Holtite socket is part of the renowned Augat brand, which today claims the widest range of products available on the market. - High-reliability solderless connectors
The D01 series from Harwin has been extended to include a range of 2.54mm pitch connectors, offering high reliability for solderless board-to-board applications.

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