News Release from: Genalog
Edited by the Electronicstalk Editorial Team on 6 November 2002
Futurebus data connectors
The Harwin Futurebus connector system is based on a modular 2mm grid for high-density high-speed signal board-to-backplane applications at a datarate of 0.622Gbit/s.
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Designed for use in telecomms, networking and high-end computing applications, the Harwin futurebus connector system is based on a modular 2mm grid for high-density high-speed signal board-to-backplane applications at a datarate of 0.622Gbit/s. End-to-end stackable PCB receptacles and headers provide design flexibility. The vertical male headers and right-angle female receptacles are available in one, two, four and eight module formats with four- and five-row options.
Press-fit leads offer fast, solderless connector to PCBs.
Housing are made from high-temperature liquid crystal polymer and the contacts are selective gold/tin-plated.
The components have a current rating of 1A per pin, an initial contact resistance of 25mohm and operate between -55 and +125C.
They are supplied tube packed.
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