News Release from: GD Technik
Edited by the Electronicstalk Editorial Team on 25 February 2002
Multichip package embeds RISC processor and memory
The WED3C7558M multichip package combines a 350MHz Power PC 755 RISC processor with 1Mbyte SSRAM L2 cache, giving it a high performance and density that makes it ideal for embedded control.
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The WED3C7558M multichip package combines a 350MHz Power PC 755 RISC processor with 1Mbyte SSRAM L2 cache, giving it a high performance and density that makes it ideal for embedded control applications. Manufactured by White Electronic Design Corp, the device is available from GD Technik. This innovative combination of the 755 processor and SSRAM offers 60% in board space saving compared with a discrete solution.
Besides reducing the parts count, other benefits include lower inductance and capacitance, and reduced I/O requirement from 560 down to 255.
The 350MHz processor and two 128K x 36, 175MHz synchronous pipeline SRAMs are flip chip attached on a 255 ceramic ball grid array (CBGA) or optional ceramic column grid array (CCGA).
Power management features include doze, nap, sleep and dynamic power management.
Footprint compatible with the 745 BGA, the module measures 21 x 25mm - a footprint of 525mm2, compared with 1329mm2 for a discrete approach.
The units are available in commercial, industrial and military temperature ranges, and are particularly suitable for embedded applications such as aerospace, navigation and fire control.
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