Product category: Communications ICs (Wired)
News Release from: Fujitsu Microelectronics Europe | Subject: Eight-chip MCP
Edited by the Electronicstalk Editorial Team on 15 May 2002
Multichip package crams eight into one
Fujitsu Microelectronics has developed an ultra-high-density multichip package (MCP) that can support up to eight chips.
Fujitsu Microelectronics has developed an ultra-high-density multichip package (MCP) that can support up to eight chips This development was made possible by the company's advances in thin chip processing and multistacked package technology
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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