Product category: Memory Devices and Modules
News Release from: Fujitsu Microelectronics Europe | Subject: MB84VZ064A
Edited by the Electronicstalk Editorial Team on 20 December 2001
Four in one for futureproof mobile memory
Fujitsu has launched the world's first four-stacked multichip package (MCP) memory, the MB84VZ064A.
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Fujitsu has launched the world's first four-stacked multichip package (MCP) memory, the MB84VZ064A. The device combines a pair of 64Mbit NOR dual-operation memory chips, 32Mbit mobile FCRAM with asynchronous SRAM interface and 8Mbit SRAM, for the world's largest memory capacity among MCPs. In addition a two-stacked MCP incorporating 64Mbit FCRAM has also been announced providing the highest mobile FCRAM on the market in a 9 x 9mm package.
Samples of both are currently available with volume production expected during Q2 2002.
The four-stacked product combines the memory used in two existing MCP products in a single four-chip stacked MCP with a 103-ball (10.0 x 9.0 x 1.4 mm) plastic BGA package.
Combining these chips into one package reduces the total mounted surface area to about 63% of the previous combination of packages Recently there has been a clear trend towards smaller mobile devices with higher functionality.
With the introduction of 2.5G and 3G mobile phones next year in Europe, there is the expectation for increasing demand for phones with improved functionality and higher transmission speeds.
These developments have created a demand for MCP memory that is physically smaller and runs on less power, but with more capacity and speed.
Fujitsu's new MCP includes two 64Mbit NOR-type dual-operation memory chips for storing programs and data.
This memory, fabricated using of 0.17-micron process technology, runs faster than previous NOR-type products, performing sector erase operations in 0.2s (1s for previous models), with access speeds of 70ns (80ns for previous models), and significantly improved electrical features.
The new MCP includes 32Mbit mobile FCRAM and 8Mbit SRAM.
This new second-generation FCRAM uses just 25mA of operating current and achieves access speeds of 70ns.
The two-stacked MCP has been developed as a stacked MCP that combines two essential chips used in mobile phones - memory and RAM (either mobile FCRAMTM or SRAM) - into one 9 x 9mm, 65-ball PBGA package.
The new series includes four products: a new 64Mbit NOR-type dual-operation memory chip with either an 8Mbit SRAM chip or a 16, 32 or 64Mbit mobile FCRAM chip with an asynchronous SRAM interface.
Recent advances in mobile phone technology, driven by improved functionality and the addition of new services, have generated demand for memory with optimum levels of functionality and capacity.
However, there is no standardisation in the packaging of the chips that power them.
If there are any changes required in the memory capacity of the chips during the product development phase, the memory-device mounted area of the printed circuit board would need to be redesigned, resulting in large additional costs and time delays.
Fujitsu therefore developed this new series to solve this problem, standardising the memory packages for mobile phones.
If there are any sudden changes to the specifications of a mobile phone during the product development phase, designers can simply mount an MCP with the required combination of memory capacity and functions, without having to redesign the board area mounted with the memory device, thereby reducing the time and costs of development and design work.
Combining 64Mbit of memory with a 16Mbit FCRAM, Fujitsu's new MCP reduces the total mounted surface area to as much as 61% of the previous packages.
For storing data and programs, Fujitsu's new MCP uses memory that is fabricated using 0.17-micron process technology with the same characteristics as mentioned with the four stacked MCP.
The 16, 32 and 64Mbit FCRAMs are application-specific memories for mobile phones that offer access speeds of 80, 70 and 70ns, and standby currents of 70, 100 and 150uA, respectively, and power-down current of just 10uA to combine high speeds with low power consumption.
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