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News Story from: Fujitsu Microelectronics Europe
Edited by the Electronicstalk Editorial Team on 8 June 2001

Memory combines Flash with mobile FCRAM

Fujitsu Microelectronics has introduced a stacked multi-chip package (MCP) integrating 64Mbit dual-operation Flash memory and 32Mbit mobile FCRAM.

Note: A free brochure or catalogue is available from Fujitsu Microelectronics Europe on the products in this news story. Click here to request a copy.

Fujitsu Microelectronics has introduced a stacked multi-chip package (MCP) integrating 64Mbit dual-operation Flash memory and 32Mbit mobile FCRAM, designed to provide the low power and high density required for the latest cellular telephones. Fujitsu's new MB84VD23483EJ combines the NOR-type Flash memory and the mobile FCRAM with an SRAM-compatible asynchronous interface. The functionality provided by the latest generation of mobile phones and other wireless communication devices, including full motion video, still camera imaging, digital radio reception, personal organiser facilities and other advanced features have been rapidly expanding, making services such as internet access, e-mail, video gaming, music downloading and video streaming everyday activities.

Combining high density, high speed and low power, this MCP device makes an excellent choice for these latest mobile phones.

Capable of operating from a 2.7 to 3.1V power supply, the Flash memory in standby mode offers a maximum power consumption of only 5uA, while the mobile FCRAM consumes just 10uA in power-down mode and 100uA during operating conditions.

Flash read and program access times are typically 16ns and access time for FCRAM is typically 90ns.

The new stacked MCP incorporates Fujitsu's innovative FlexBank architecture embedded in the Flash memory, which allows flexible allocation of data or programs to banks according to customers' system requirements.

Dual operation Flash architecture enables the device to read from one partition while programming or erasing in another, making it possible to achieve high-speed processing.

Samples of the MB84VD23483EJ MCP in standard plastic 81-ball BGA packages are now available and mass production will start in October.

Request a free brochure from the manufacturer....

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