Arcom Control Systems

News Release from: Flomerics
Edited by the Electronicstalk Editorial Team on 22 October 2002

Success for thermal analysis software

Intel, HP, Agilent, Sanmina, Cisco and Sun are just a few of the companies that have renewed their Flotherm license agreements in multiple-year deals worth nearly $3 million.

Note: A free brochure or catalogue is available from Flomerics about its services. Click here to request a copy.

Intel, HP, Agilent, Sanmina, Cisco and Sun are just a few of the companies that have renewed their Flotherm license agreements in multiple-year deals worth nearly $3 million, reaffirming Flomerics' number-one status in the supply of thermal analysis software to the electronics industry with approximately 70% of the global market. Flomerics has also reported several high-profile contract wins such as Solectron, Alcatel and Redback Networks within the telecommunications and PC component sectors despite the continuing downturn hitting orders within the industries. In addition to turning in a strong financial performance, the Flotherm software appears at number two on the list of Top Software Products in the Electronics Industry Yearbook 2002 (published by Reed Electronics Group).

Flomerics also won the Gold Award for Exhibitor Excellence - for the third year running - at the 18th annual Semi-Therm conference in San Jose, California.

Sherman Ikemoto, Marketing Manager, Flomerics, explains: "Flomerics has a very strong product for process-orientated design issues.

Companies who depend on Flotherm have reduced already short design cycles by several weeks".

He adds: "Flomerics has been retained by these companies because it is the industry benchmark standard for electronic thermal models.

This means that there is a huge community using and improving the software, building a vast library of standard models that can be dispersed across departments and suppliers".

Flotherm enables companies to cut their design time by automating more of the design optimisation processes than competitor products and also by reducing duplication through library and model sharing facilities.

This ultimately results in faster and more reliable solutions to thermal design issues.

Furthermore, with Flotherm being the de-facto standard thermal analysis software in the global electronics marketplace, once developed, a processor or chip model can quickly and easily be transferred to customers for analysis within a board or IC design.

Scott Burton, Package Analysis Engineer, for Agilent's ASIC Product Division said, "We can produce accurate, validated compact models of our new components in a matter of minutes.

The result is that we can generate simulated thermal characterization data based on JEDEC standard tests in much less time than was required with previous approaches.

As an added feature, we can now provide our customers with models that they can drop into a full thermal design simulation.

This allows them to model the behaviour of the component in their system environment with minimal effort".

Flotherm customers are also broadening their use of thermal analysis as computing power and heat loads rise.

Instead of concentrating solely on components and IC design, Flomerics is finding that environment-level analysis such as systems within racks and even entire data centres are being modelled to overcome potential thermal issues.

This is being driven by the rising power requirements of faster microprocessors and is leading to increased model standardisation between companies right from component manufacturers up to system integrators.

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