Start with the news release Tyco announces JEDEC-based memory module from Tyco Electronics, which we summarised at the time by saying "Tyco Electronics has introduced a very low-profile (VLP) double-data-rate 3 (DDR3) dual in-line memory module (DIMM) socket designed around JEDEC industry standards. ". Several months prior to that, we featured the news release C-Mac to co-develop optical communications device from C-Mac Microtechnology: "C-Mac Microtechnology and Ultra Communications are to co-develop 10Gb/s optical transmit and receive modules for military and space applications. ".
 
In August 2010, we covered the news from Lattice Semiconductor - take a look at Lattice upgrades IspLever Classic design tool which says: "Lattice Semiconductor has released version 1.4 of its IspLever Classic design tool suite to provide a design environment for Lattice complex programmable logic devices (CPLD).".
 
Take a look also at the news release from Toshiba Electronics, Flash memory for digital consumer applications, as well as Axeram memory kits target Intel Core platforms from 2001 Electronic Components, and Toshiba embedded flash module has 64GB memory from Toshiba Electronics Europe.