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Product category: Capacitors
News Release from: Flint | Subject: Syfer FlexiCap
Edited by the Electronicstalk Editorial Team on 26 February 2003
MLCCs take rougher handling without
cracking up
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A new range of chip capacitors can handle up to 400% more mechanical stress in case sizes from 0603 to 3640.
New chip capacitors that can handle up to 400% more mechanical stress have been introduced by Flint, in case sizes from 0603 to 3640, greatly reducing the well-known risk of cracking during board assembly The new range of Syfer chip capacitors from Flint is based on the X7R dielectric, and address the issue of stress damage to MLCC (multilayer chip capacitor) devices caused by board flexing during the assembly process