News Release from: Envisage Systems
Edited by the Electronicstalk Editorial Team on 7 October 2005
Wafer inspection system zaps out faulty chips
A new low cost wafer inspection system enables electronic component manufacturers producing ceramic or silicon wafers to automatically inspect each wafer optically for faults.
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Envisage Systems, the maker of the Capvis visual inspection system, has launched a new, low cost wafer inspection system, which enables electronic component manufacturers producing ceramic or silicon wafers to automatically inspect each wafer optically for faults. Typical defects such as broken or breached tracks, scratches, extra material or contamination can be detected, without human intervention and to repeatable exacting company standards. The system is available with or without an integrated faulty chip destruction laser.
The complete system including laser will typically cost in the region of $87,000 or $55,000 without the laser.
An operator places each wafer onto an x-y inspection table, which is then moved under a high-resolution camera.
The camera moves from component to component, building up a map, in memory, of any faulty components.
When the inspection is complete, the wafer moves to the destruction position under the laser, which fires a series of tiny pulses to destroy the faulty components and prevent them from continuing in the production process.
According to Mike Phillips, CEO of Envisage Systems: 'This new system closes the loop on the inspection process for those companies yearning to produce perfect, zero defect chips'.
'Instead of the labour intensive process of an operator having to inspect each wafer with a microscope, this system, which has a cycle time of only 15 minutes per wafer, depending on component size, can be operated virtually unmanned, saving both time and manpower'.
'Users can then employ our integrated laser or use the co-ordinate map output function to mesh with their own existing laser destruction system'.
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