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News Release from: Elfnet
Edited by the Electronicstalk Editorial Team on 23 May 2006
Database details SnAgCu solder properties
Elfnet has collaborated with COST 531 to deliver a much-needed database of physical and mechanical properties for the new tin-silver-copper (SnAgCu) lead-free solder alloys
Elfnet - the European lead-free soldering network - has collaborated with COST 531 to deliver a much-needed database of physical and mechanical properties for the new tin-silver-copper (SnAgCu) lead-free solder alloys. This data is key to modelling behaviour of lead-free solder joints that from July 2006 will be at the heart of most electrical and electronic equipment in Europe.
This article was originally published on Electronicstalk on 23 May 2006 at 8.00am (UK)
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'Elfnet has been bringing together communities of research and industry experts to prioritise lead-free technology implementation issues and develop collaborative solutions'' comments Dr Jeremy Pearce, Elfnet Co-ordinator.
'This database represents a key achievement in exploiting expertise in the academic research community to the direct benefit of the electronics industry'.
Since the introduction of lead-free soldering was first planned in the 1990s, the collation of the huge amount of property data being generated has been a much-stated goal.
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The European electronics industry is entering a business-critical period with only nine months to go before the RoHS Directive deadline of July 2006
The data are required for feeding into joint modelling software and for quantifiable understanding of comparative behaviour of lead-free solder joints in different environments.
Some such databases do already exist, although some are closed to public access.
Notable is the online database published in 2002 by National Institute of Standards and Technology (NIST) and Colorado School of Mines.
All lack key information about the testing methods used to generate the data and contain sometimes widely variant data.
COST 531 is a network of over 60 universities across Europe, co-ordinated by University of Vienna, Austria.
This resource has special expertise in metallurgical research and had already begun to generate data on lead-free solder alloys.
Elfnet had identified the need for a new initiative in this area and in March 2005 it was agreed that this would be undertaken jointly with COST 531, led by Clemens Schmetterer at the University of Vienna.
The SnAgCu alloy family was selected as the first priority based on its use as the predominant lead-free solder in the industry.
The team worked to exhaustively review all available published data and some unpublished results, with particular efforts made to link data to accurate descriptions of the test methods used.
30 different compositions of the alloys have been described.
The data are available as a user-friendly downloadable PDF file, with diagrams, tables and detailed references.
The first version of the new database was launched at the Semicon Europa 2006 exhibition in Munich in April 2006 and can accessed for free on the Elfnet website.
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