News Release from: Elfnet
Edited by the Electronicstalk Editorial Team on 6 March 2006
Semicon Europa hosts lead-free village
The European Lead-Free Soldering Network, has collaborated with SEMI to deliver a package of lead-free solutions at the forthcoming Semicon Europa in Munich.
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Elfnet, the European Lead-Free Soldering Network, has collaborated with SEMI to deliver a package of lead-free solutions at the forthcoming Semicon Europa in Munich, 4th-6th April 2006. Top experts from Europe and the USA will be available in the exhibition at Elfnet's 'Lead-Free Village' and will stage a series of key presentations on lead-free solutions for assembly and packaging in the Hall A3 Technology Arena. 'Elfnet has been working hard to bring together communities of research and industry experts to prioritise lead-free technology implementation issues and develop collaborative solutions', comments Dr Jeremy Pearce, Elfnet Co-ordinator.
'SEMI hosts this event and contributes this important platform to deliver those solutions ahead of the July 2006 RoHS Directive deadline', confirms Pierre Lucas, Director of Public Policy, SEMI Europe.
It is already clear that on some of the identified issues much of the key knowledge in Europe is held by a few.
It is the urgent task of Elfnet through its website and at dedicated events such as the conference at Semicon Europa 2006, to bring this information to the wider community.
As the deadline approaches the focus is increasingly on supply chain and compliance, for example component supply, marking and labelling, materials declaration, component numbering and compliance testing.
Speakers from IEC, ZVEI, IPC, iNEMI, Farnell InOne and Soldertec will give the very latest positions on these topics at Semicon.
Obsolescence is a key issue for currently exempt sectors such as aerospace/defence.
Here Elfnet has worked via BAE Systems with the UK organisations Component Obsolescence Group (COG) and the National Physical Laboratory (NPL) to sponsor production of a new guidance booklet for the industry.
Reliability has been and for some time will be a major area of concern.
A large amount of data has been produced but much still seems inconsistent.
As the materials technologies and fundamental science develop the picture is clearing, but there are still large gaps.
Through IMEC (Belgium), Elfnet has initiated a data exchange project to seek better harmonisation.
Testing remains a complex area, with standards in development but many not yet published.
Often linked to this are concerns over tin whiskers, for which testing standards are in place but confidence in mitigation practices awaits resolution of debates over mechanism.
Elfnet has growing working groups in both reliability and tin whiskers, and these experts will present and also be available for consultation.
A newer issue, highlighted by work from iNEMI in the USA, relates to thermal compatibilities in processing large and complex boards, such as are typically used in IT/telecomms or aerospace/defence applications.
Here the higher temperatures of lead-free processing exacerbate laminate degradation, limit hole filling and can give repair and rework difficulties.
During transition there is also likely to be mixed assembly of both tin-lead and lead-free systems on the same board, as well as very large and very small components.
Key players NERA Networks, Ericsson and Philips will address these topics at Semicon Europa.
Experts at the University of Vienna are tackling a long-standing need to bring together solder alloy property data in easily accessible datasheet form, in a joint initiative between Elfnet and the COST 531 network.
Other solder developments are also being watched closely, including, for example, tin-zinc solders, SnAgCu+ alloys and new low-silver solders.
The Elfnet project has been funded by the European Commission to provide the best available opportunity for co-ordinating efforts in pan-European technical progress on lead-free soldering technology and ensure that its electronics industry remains competitive.
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