News from: Elcon Products International
Edited by: Electronicstalk Editorial Team on 26 July 2002
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The popular range of Minipak high-density board-to-board power connectors from Elcon has been enhanced with new features and improved design flexibility.
Combining high-performance contact technology with high-density packaging and the highest possible power density, these new connectors will provide the ideal configuration for most applications.
Improvement is due to combing the powerful Elcon Crown Band contact element with the ability to mix and match power and signal contacts and the provision of a new alignment feature.
Minipak connectors can be configured with power contacts at a pitch of 7.5, 6.0 or 4.5mm to meet different voltage spacing requirements.
Current ratings depend on the contact layout and contact pitch selected for a given configuration up to a maximum of 60A per individual Minipak blade.
This performance is due to the Crown Band contact used in all Minipak connectors that has ten contact tails interfacing with the mounting board.
This, together with a socket design featuring multiple points of contact, results in greatly reduced contact resistance.
Mounting to the board or backplane can be by solder tails or truly compliant press-fit tails with a non-collapsible structure for reliable solderless mounting.
Minipak also provides blind mating capability and multiple levels of sequencing for both power and signal that allows hot swapping of power supplies.
An optional alignment guide, built into the PIN and socket housing, is available for designs that require extra alignment correction.
Minipak pin housings are fully shrouded and the socket contacts are recessed to be finger probe-proof meeting all UL (USR and CNR) and TUV safety requirements.
The system is ideal for telecom and computer applications, including routers, servers, mini and supercomputers, and UPS and hot-swap N+1 power distribution in general.
