Product category: PCB Assembly Equipment and Tools
News Release from: Ekra | Subject: X5-WAF
Edited by the Electronicstalk Editorial Team on 15 November 2001
Inline printer puts BGA bumps on 300mm
wafers
Ekra has released the X5-WAF, a new inline wafer bumping system.
Ekra has released the X5-WAF, a new inline wafer bumping system The X5-WAF is a stencil printing system which can print 300mm diameter wafers precisely with solder paste
This article was originally published on Electronicstalk on 14 Nov 2001 at 8.00am (UK)
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In electronics manufacturing the term "advanced packaging" stands for cost reduction and ongoing miniaturisation for electronics components.
An important contribution in terms of cost reduction is the so-called wafer bumping, a process where the dies or flip-chip/ball grid arrays (BGA) are bumped with solder paste.
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