Product category: Exhibitions, Courses, Conferences and Training
News Release from: Dynamix Technology
Edited by the Electronicstalk Editorial Team on 24 January 2006
Training and reference
guides update to lead-free
IPC Training and Reference Guides have been updated to IPC-A-610D and IPC-J-STD-001D, which include lead-free references
These Desk Reference Guides illustrate the critical acceptance criteria for the evaluation of surface mount and plated through-hole solder connections - to the latest requirements of the IPC assembly standards. All the latest requirements from revision C of these guides have been fully notated, to assist inspectors and operators to quickly locate and understand these changes.
Related stories
New standard covers land pattern design
Available now from IPC authorised distributor Dynamix Technology, the new IPC-7351 'Generic requirements for surface mount land pattern and design' standard replaces IPC-SM-782A
Standards revised for Pb-free processing
Available now from IPC authorised distributor Dynamix Technology are new and updated versions of IPC-A-610D and IPC-J-STD-001D
At a compact size, these convenient spiral-bound manuals are convenient to use in the classroom or on the shop floor: Desk Reference Manual DRM-SMT-D contains computer generated illustrations of chip components, gullwing and J-Lead solder joints.
Each drawing clearly shows the minimum acceptable condition for all types of component misalignment, and details the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
Desk Reference Manual DRM-PTH-D contains illustrations of component, barrel, and solder-side perspectives of a plated-through hole, showing the minimum acceptable conditions for requirements such as land coverage, vertical fill, wetting of lead, land, barrel and contact angle.
Further reading
PCB specifications updated
Dynamix Technology has released enhanced versions of two of the most popular IPC documents
(This replaces DRM-40) Both manuals contain high quality colour microphotographs of the major solder defects and conditions, such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections.
With over 30,000 copies sold of these manuals, it is expected that there will be high demand for these updated versions, those involved in manufacturing, inspection and training are urged to order today.
Both documents are available in hard copy or electronic format.
IPC - Association Connecting Electronics Industries is represented in Europe by authorised distributor and independent consulting company Dynamix Technology.
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