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News Release from: Dynamix Technology | Subject: IPC-7351
Edited by the Electronicstalk Editorial Team on 18 April 2005

New standard covers land pattern design

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Available now from IPC authorised distributor Dynamix Technology, the new IPC-7351 'Generic requirements for surface mount land pattern and design' standard replaces IPC-SM-782A

The new standard covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. It provides an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern geometries for each component that allows the user to select a land pattern based on desired component density.

It also includes updates to existing sections addressing land pattern guidelines for wave or reflow soldering, via location guidelines, fiducials and courtyard boundaries.

IPC-7351 includes both the standard and an additional key component: the IPC-7351 Land Pattern Viewer on CD-ROM.

IPC-7351 represents a change in the way land patterns are developed, categorised and defined - all key ingredients to building a new industry CAD library.

Like its predecessor, IPC-7351 relies on proven mathematical algorithms that take into account fabrication, assembly and component tolerances in order to calculate precise land patterns.

The standard improves on the concepts developed for IPC-SM-782 by providing clear descriptions of the solder joint engineering goals for each component family, as well as providing the user with an intelligent naming convention that aids in the lookup of land patterns.

IPC standards, including those for PCB design, are the result of industry consensus and collaboration respected throughout the world.

Using IPC standards allows manufacturers, customers and suppliers to speak the same language.

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