Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: VPC
Edited by the Electronicstalk Editorial Team on 10 July 2007
Carrier cuts down on alignment processes
Novel substrate centring and carrier technology enables multiple component support and alignment during screen printing and all subsequent assembly processes.
Building on the technology of its award-winning Virtual Panel Tooling (VPT) high throughput substrate imaging system, DEK has advanced this concept even further and developed Virtual Panel Carrier (VPC) A ground-breaking substrate centring and carrier technology, VPC enables multiple component support and alignment during screen printing and all subsequent assembly processes
This article was originally published on Electronicstalk on 28 May 2008 at 8.00am (UK)
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