Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: Galaxy
Edited by the Electronicstalk Editorial Team on 18 November 2003
Printer looks to next-generation packaging
The Galaxy screen printer is a new platform that meets future speed and accuracy demands for SMT assembly and advanced semiconductor packaging
Galaxy's arrival means semiconductor packaging processes can benefit immediately from Galaxy's advanced motion control and machine vision as commercial chip scale package production hits its stride. And SMT assemblers can confidently plan to implement processes at the boundaries between assembly and packaging, knowing that the technology exists to support them.
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In addition to enhanced speed and accuracy, Galaxy also features the advanced DEK Instinctiv user interface for enhanced productivity, extensive communication capabilities to aid management of complex processes, and traceability features that deliver benefits in many high-value markets.
"High accuracy mass imaging is increasingly the tool of choice for many of the processes required to assemble advanced flip chip and chip scale packages in commercial volumes", said Rich Heimsch, President of DEK International.
"Galaxy embodies the expertise we have built up through working with prominent component manufacturers and packaging specialists to perfect leading-edge processes and techniques".
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Semiconductor component assemblers worldwide are now using cutting edge mass imaging technology to place solder balls at wafer and substrate level, and to deposit flux, underfill, encapsulant, thermal interface material (TIM) and adhesives when building flip chip and chip scale packages.
In response, DEK has evolved its patented ProFlow Direkt Imaging technology to deliver economically compelling; high Galaxy now consolidates these technologies onto a next generation platform, creating a turnkey solution for packaging specialists.
And as SMT assemblers plan for the future, in which they too will demand back-end packaging capabilities at wafer and substrate level, Galaxy allows them to achieve this using equipment with which they have acquired great familiarity.
They can also easily keep up with the inevitable re-acceleration of pitch reductions entering mainstream production that require a new level of accuracy to manufacture successfully.
"While the Typhoon class Horizon and Infinity series are capable of working with all current packaging types, the performance of Galaxy is, ultimately, one generation ahead", said Heimsch.
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