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News Release from: DEK
Subject: Direkt Ball Placement
Edited by the Electronicstalk Editorial Team on 22 May 2003

Process achieves better than 99% first-pass yield

A variety of advanced process technologies developed by DEK offer significant performance and cost advantages for semiconductor packaging.

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A variety of advanced process technologies developed by DEK offer significant performance and cost advantages for semiconductor packaging. As the world's leading provider of advanced preplacement manufacturing solutions, DEK has focused its applications expertise on achieving new levels of throughput, accuracy and repeatability in wafer bumping, using a cost-effective screen printing platform. DEK's semiconductor packaging technologies include Direkt Ball Placement, a fully automated wafer handling solution and virtual panel tooling (VPT).

These solutions may be incorporated in a production line individually or in combination with each other to enhance productivity in comparison with traditional approaches.

Direkt Ball Placement uses DEK's patented ProFlow Direkt Imaging technology to place solder balls as small as 0.3mm in diameter onto substrates or wafers, with fine-pitch accuracy and first-pass yields consistently better than 99%.

The integrated process begins with flux deposited at each interconnect site using DEK's sophisticated flux imaging technology.

The fully enclosed ProFlow ball transfer head, which can hold up to 50 million solder balls, guides each solder ball directly to the surface of the stencil with minimum friction.

A controlled placement force seats each ball gently but firmly in the flux, enhancing assembly integrity during downstream handling and reflow.

Cycle time is fast, consistent and independent of I/O count.

The excellent coplanarity that is achieved optimises electrical and mechanical performance.

Tooling options allow the system to accept singulated substrates, strips, panels or boats.

DEK's Direkt Ball Placement may be integrated with a fully automated wafer handling station.

Developed in conjunction with specialist partner Adept semiconductor equipment Division, the station can accept 150, 200 and 300mm wafers.

Each wafer is unloaded automatically from the cassette onto the wafer chuck.

After solder ball placement or paste deposition, the wafer may be returned to its original position in the cassette or transferred directly to a reflow oven.

The station complies with SMEMA and SEMI S-2 industry standards.

With virtual panel tooling, dozens of substrates are aligned independently and simultaneously to create a virtual panel that can be imaged in a single cycle, creating multiple, highly accurate processed substrates at high speed.

VPT delivers high throughput comparable to processing panelised substrates, with accuracy comparable to individually aligned substrates.

Typical applications include solder paste printing, solder ball placement, epoxy printing for die attach, and conductive adhesive deposition.

DEK's advanced process technologies for semiconductor packaging all overcome the limitations of high-cost dedicated equipment.

The screen printer platform that serves as the foundation of the technologies can be reconfigured, quickly and easily, for a wide variety of materials deposition processes.

The platform's adaptability to changing production requirements enhances productivity through cost-effective flexibility as well as speed and accuracy.

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