Nepcon launch for upgraded solderability tester

Solderability tester performs all forms of solderability tests in accordance with all major international standards.

Set for launch at Nepcon UK, the MUST System 3 is the latest evolution of the original Multicore Universal Solderability Tester (MUST) platform that formed the basis of all modern solderability test standards from its introduction 32 years ago (1975).

The MUST solderability tester family remains the unquestioned industry benchmark for solderability testing and test systems with over 2500 users worldwide.

The MUST 3 performs solderability testing - namely wetting balance and microwetting globule testing - in accordance with all major international standards and is capable of performing all forms of solderability tests.

This includes IEC60068-2-69 plus subsequent -20/-54/-57 Revisions; MIL-STD-883 Method 2022; IPC/EIA J-STD-003A; IPC/EIA/JEDEC J-STD-002B; and EIA /JET-7401.

This includes the edge dip test methods of IEC60068-2-20 and 60068-2-58; IPC/EIA/JEDEC J-STD-002B; and IPC/EIA J-STD-003A.

Key enhancements of the MUST 3 include greater measurement accuracy (better than 0.01mN force resolution) and sampling rates, Windows Vista compatibility, plus accelerated and quieter operation.

"As PCBs and components continue to become smaller and finer in lead pitch, coupled with the widespread use of less active fluxes and in particular the move to higher lead-free soldering temperatures, soldering process windows have narrowed and the impact of poor solderability is more dramatic", explains Graham Naisbitt, Gen3 Systems' Managing Director.

"Although components and PCBs are generally assembled from parts of known (good) solderability, there is no way of guaranteeing this without testing: especially given that the prime cause of poor solderability is poor storage conditions and extended time on the shelf".

"Gen3 Systems co-operates with IEC, ISO, IPC, BSI and other official standards authorities to help maintain and develop measurement standards including solderability metrology".

"The Must 3 represents decades of our collective experience and expertise channelled into the latest enhancement of what was already the industry-leading benchmark for solderability testing", concludes Naisbitt.

By eliminating problems associated with poor solderability, the MUST 3 can significantly improve product quality and yield large potential cost savings by lowering defect rates during the soldering process.

It can also help facilitate the use of less aggressive (lower activity) no-clean and environmentally-friendly soldering materials - including, of course, lead-free alloy testing - and is capable of testing at temperatures in excess of 260C.

In operation, the MUST 3 automatically detects a small solder bath (for TH devices) or globule (for SM components) that is mounted on a computer-controlled worktable capable of being motor-driven in all three x-y-z axes.

This allows the instrument to align contact between the component termination and solder precisely, guaranteeing test reproducibility and accuracy.

Furthermore, for multileaded components, this allows the globule to be advanced automatically to each subsequent termination.

In each case, a component outline-specific specimen clip firmly holds the component in the correct position for testing.

12 specimen clips are provided as standard to allow testing of the majority of leaded and SM components, and a policy of continuous product development at Gen3 Systems means that clips are made available for new components.

The MUST 3 exploits easy-to-use Windows-based software that guides users step-by-step through the entire test procedure via on-screen prompts.

It also controls the semi-automatic replacement of the solder globule block or bath and the operation of a safety cover, preventing users from making accidental contact with the molten solder.

Testing is initiated by simply selecting the relevant component code and its associated set of test parameters (the MUST 3 stores hundreds of parameter and default test files of various SM components).

This procedure ensures that each test is performed correctly.

The MUST 3 software then automatically calculates and records the component's solderability value and wetting curve, which can be presented as an immediate pass/fail for each device or stored for future reference.

The MUST 3 also allows bare board manufacturers and assembly companies to test and guarantee the solderability of their PCBs.

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