System cuts PCB inspection costs

Cupio's YESTech YTV F1-series AOI system allows simultaneous checks for sufficient solder on the pad, flow onto the lead toe, dry solder and a lifted lead with a single inspection.

Cupio's YESTech YTV F1-series AOI system delivers automated in-line PCB inspection with reduced costs, improved quality and increased throughput to high-volume electronics manufacturers.

The F1 can be set up quickly and combines exceptional defect coverage with a low false failure rate.

The F1's Fusion lighting system contributes significantly to its inspection speed and reliability.

Fusion lighting has angled red, green and blue high-intensity LED arrays surrounding the part or joint being inspected.

These can be combined and digitally filtered to highlight the fault mechanism of interest while eliminating any spurious background interference.

Unlike single or multi-angle white lighting the Fusion lights can highlight solder at different angles to detect and check different parts of the profile.

Using angled, coloured lights also allows setup flexibility to inspect solder at different levels and angles simultaneously.

This allows simultaneous checks for sufficient solder on the pad, flow onto the lead toe, dry solder and a lifted lead with a single inspection.

The F1 uses Thin Camera technology with up to two top-down viewing cameras and four side-viewing cameras to inspect solder joints and verify correct part assembly.

Operators typically take less than 30 minutes to create a complete inspection program, including solder inspection.

The F1 uses a standard package library to simplify training and ensure program portability across manufacturing lines.

The F1 is equally effective for all line positions including paste, pre/post-reflow or final assembly inspection.

Offline programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.

Back to top