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Product category: Design and Development Software
News Release from: Cadence Design Systems
Edited by the Electronicstalk Editorial Team on 16 July 2007

Pattern-synthesis technology acquired

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Invarium's pattern synthesis capabilities enable superior pattern resolution and faster yield ramp for designs targeted to 45nm process technologies and below

Cadence Design Systems has acquired Invarium, a San Jose-based developer of advanced lithography-modelling and pattern-synthesis technology. Invarium's pattern synthesis capabilities enable superior pattern resolution and faster yield ramp for designs targeted to 45nm process technologies and below.

This acquisition creates the path to the industry's leading DFM solution for functional and parametric yield improvement, enabling the prevention, detection, correction and optimisation of manufacturing effects on advanced geometry designs.

Invarium's specific area of expertise is the development of pattern-synthesis technologies that enable superior photomask design and process optimisation, encompassing the entire manufacturing-process flow from mask making to lithography and etch, with industry-leading speed.

'Invarium's layout-to-mask solution is in use by manufacturers of custom and memory designs at advanced process nodes, where the highest level of accuracy and widest process latitudes are required', says Roy Prasad, President and CEO of Invarium.

'Augmenting the Cadence design-side DFM leadership with Invarium's manufacturing technology will allow us to provide global customers a comprehensive DFM solution, from design implementation through silicon signoff and manufacturing'.

'At 45nm and below, the semiconductor industry is looking at a new set of patterning challenges that include double patterning, printability and scaling of very fine features, and the margin for error is extremely small', says Jim Miller, Executive Vice President, Products and Technologies Organisation, for Cadence.

'The acquisition of Invarium will enhance Cadence's ability to address these challenges head on'.

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