Product category: Design and Development Software
News Release from: Cadence Design Systems
Edited by the Electronicstalk Editorial Team on 10 October 2005
Design flow to
target complex RF devices
Cadence Design Systems and UMC are to develop a comprehensive reference solution for complex wireless designs
The jointly developed reference solution, which will be based on the Cadence Virtuoso custom design platform and targets UMC's RFCMOS processes, will also include a reference design and other key technology from UMC. Growing demand for analogue/mixed-signal and RF devices for wireless applications, such as WLAN 802.11, UWB, and Bluetooth, is driving the need to integrate these various components into a single SoC and accelerate the path to wireless design.
This article was originally published on Electronicstalk on 10 October 2005 at 8.00am (UK)
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This new collaboration addresses these challenges by combining UMC's RFCMOS process technologies to deliver RF capabilities and Cadence's analogue/mixed-signal and RF design tools and flow integration.
The collaboration's first key milestone - the verification of the reference design - has been completed using the Virtuoso platform.
'Aggressive consumer demand for wireless products makes it critical for our customers to achieve silicon success quickly and meet market demand', said Patrick T Lin, Chief SoC Architect, System and Architecture Support at UMC.
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'By leveraging Cadence's Virtuoso platform with UMC's advanced manufacturing capabilities, we can provide a streamlined methodology for the design, simulation and integration of different components into complex SoCs used in wireless devices'.
The reference design consists of digital baseband physical layer blocks, mixed-mode 1GHz AD/DA convertor blocks, RF components, along with several pieces of enabling intellectual property (IP) from UMC.
The companies plan to complete development of the reference flow over the next several months and then harden the reference design into silicon.
Customers will ultimately be able to access a complete wireless reference design package from UMC.
The package will include the reference design, the design flow, compatible process design kit (PDK) and silicon-validation results from the reference design.
'The cost, performance and power requirements of today's advanced wireless devices are driving greater functional integration, leading to sophisticated and integrated SoC solutions', said Jan Willis, Senior Vice President of Industry Alliances at Cadence.
'Our collaboration with UMC addresses these challenges by providing customers with a comprehensive technology solution to help shorten their product development time for wireless designs'.
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