Product category: Design and Development Software
News Release from: Cadence Design Systems | Subject: APE-3D
Edited by the Electronicstalk Editorial Team on 3 October 2003
Package design software
verifies signal integrity
APE-3D is a new package that tightly couples the industry-leading Cadence Advanced Package Engineer with Optimal Corp's 3D field solver engine
The Cadence Advanced Packaging Engineer 3D (APE-3D) is a tight coupling of the industry-leading Cadence Advanced Package Engineer (APE) with Optimal Corp's 3D field solver engine. APE-3D is an electrical and physical design system that enables IC buffer designers and PCB system designers to explore, design, implement and verify interconnect topologies and electrical constraints through simulation.
This article was originally published on Electronicstalk on 3 October 2003 at 8.00am (UK)
Related stories
Emulator accelerates IC verification
Winbond Israel found that the Palladium emulator series reduced the overall verification schedule by offering prototype-like runtime performance in a live circuit environment
Mixed-signal verification increases coverage
Simulation enables verification of ultra-low-power sensor interface and transceiver platform for a wide range of healthcare and lifestyle management applications
It also enables these users to create full or partial IC package simulation models to optimise system wide interconnect performance.
Designers will need a 3D field solver to accurately model package interconnect elements such as nonorthogonal traces, vias, wire bonds and solder balls, and to take into account the non-ideal ground planes prevalent in advanced IC package designs.
With APE-3D, advanced IC package design engineers can quickly and accurately perform cost versus performance tradeoff analysis and produce more cost-effective packages in less time.
Further reading
Pattern-synthesis technology acquired
Invarium's pattern synthesis capabilities enable superior pattern resolution and faster yield ramp for designs targeted to 45nm process technologies and below
Logic designers get physical with floorplan data
'Design with physical' approach automatically delivers an accurate physical description of the design into the logic design stage
"We have successfully matched the Optimal PakSi-E simulated data to actual TDR-measured data to within 5%", said Daniel Kim, Package Engineer from Xilinx.
"The software's ability to run RLC extraction on the entire package gave us time to work on other projects".
As a leading solutions provider for advanced IC packaging design, Cadence strongly supports partnerships that integrate best-in-class technology into its market-leading design solutions.
Cadence has formed an OEM relationship with Optimal, a privately held company and leading provider of signal integrity analysis software serving the IC packaging industry.
Optimal's PakSi-E 3D is faster and more accurate than similar products currently on the market and can extract entire IC package simulation models in a timely fashion.
With the proven 3D field-solver technology from Optimal's PakSi-E coupled with APE, Cadence APE-3D offers the best-integrated technical solution for IC package design and analysis in the industry.
In an environment in which IC providers constantly feel the pressure to manage package performance, cost and design-cycle time, APE-3D provides an integrated design and analysis solution that helps IC package engineers and IC I/O buffer designers meet the increasing market demands put on them.
"Designers really benefit from the new Advanced Packaging Engineer 3D and its embedded PakSi-E field solver", said Charles Giorgetti, Corporate Vice President and General Manager of the printed circuit board Systems Division at Cadence.
"Together they provide a unique solution that enables users to focus 100% of their time on design and analysis tasks by eliminating complex design translators and cumbersome, time-consuming, stand-alone IC package analysis and modelling tools".
• Cadence Design Systems: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• NEW
• Electronicstalk Home Page
Related Business News
Icoa Is Partnering With Anchorfree To...
...Enhance And Monetize Thousands Of Wi-fi Hotspots. Icoa, Inc., a national provider of wireless broadband Internet access and managed network services in high-traffic public locations, and AnchorFree Inc., a rapidly growing Wi-Fi community powered by advertising, have announced today that they are partne
Olympics raises demand for IT contractors
The number of IT contractors working in the engineering sector has almost doubled in 12 months because of demand generated by the 2012 Olympics, according to contractor Giant Group PLC.
Stellar Appoints CIO to Lead Call...
...Centre Outsourcing Technology Strategy. Stellar, a leading global business process outsourcing provider, today announced that Warwick Marx has been appointed Chief Information Officer of Stellar Asia Pacific.
Dell pushes for better Linux drivers
Dell wants to see better software drivers for Linux so that the firm can ship more notebooks and desktops running the operating system, according to one of its software engineers.
Eds Sales Take A Tumble
Dave Friedlos, Computing , Thursday 17 May 2007 at 00:00:00 But experts say downturn may reflect market weakness, writes Dave Friedlos Outsourcing giant EDS has released disappointing first-quarter figures showing slower growth and fewer con
Search the Pro-Talk network of sites
