Product category: Design and Development Software
News Release from: Cadence Design Systems | Subject: RocketIO design kit for SpecctraQuest
Edited by the Electronicstalk Editorial Team on 24 February 2003
Design kit is popular choice
According to Cadence Design Systems and Xilinx, the Xilinx RocketIO design kit for SpecctraQuest has been adopted by over 500 designers and engineers to date
The wide adoption is a result of the Xilinx and Cadence alliance developed to enable designers to exploit the enormous capacity and system performance of the Xilinx Virtex-II Pro FPGA The kit, an electronic blueprint for simulating and implementing Virtex-II Pro Rocket IO transceivers in a system, speeds time-to-market and lowers development costs, both of which are critical to systems companies' ability to meet their profit goals.
This article was originally published on Electronicstalk on 24 February 2003 at 8.00am (UK)
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The Xilinx Virtex-II Pro family, shipping since March 2002, leads the industry in density, performance, memory, DSP processing, embedded processing and value and is the world's first and only FPGA to offer integrated PowerPC microprocessor technology and 3.125Gbit/s serial transceivers.
Virtex-II Pro devices include these multiple PowerPC CPUs and multigigabit serial transceivers at no additional charge, providing unequalled capability and value for today's system design requirements.
The Xilinx RocketIO design kit for SpecctraQuest enables engineers to be quickly productive in creating, implementing, and verifying gigahertz-speed serial links using the multigigabit IO technology.
Operating within the Cadence SpecctraQuest Signal Integrity Expert environment, it provides a proven approach to characterising the interactions between the Xilinx Platform FPGA and the rest of the system.
Designed to address the time-consuming PCB level simulation and implementation challenges created by gigahertz speed systems, the design kit helps shorten design cycles.
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"The new RocketIO design kit saved me a lot of time, particularly for multi-board simulations that involve different styles of routed differential pairs", said Mohammad W Ali PhD, Technologist, Tellabs.
"With the new interfaces in SpecctraQuest, I can accomplish the simulation task 10 to 20 times faster than before".
"In only 10 minutes after installing the RocketIO design kit, I was able to begin simulating my multigigabit solution", said Wenwei Qiao, Engineer, Applied Materials.
According to Stephane Tessier, hardware engineer at Radical Horizon, a Montreal-based software defined radio (SDR) solution provider, "The kit is a 'must have' for developing multigigabit links.
The tutorial information reduces an engineer's learning curve, and use of the kit will reduce the number of board iterations".
"The SpecctraQuest design kit helps reduce the time to implement new silicon into a system because it takes advantage of concurrent design efficiencies, using technologies that address silicon, package and board design", said Charlie Giorgetti, Cadence Vice President and General Manager of the PCB Systems Division.
The RocketIO design kit for SpecctraQuest design kit allows engineers to develop optimal constraints for their PCB systems.
These constraints then drive PCB floorplanning, routing, and verification process.
The RocketIO design kit for SpecctraQuest includes: ready-to-simulate system level topologies for typical use of the device on the board/system; verified I/O buffer models; a large package model; test bench data and correlation data; connector models for backplane applications; device specific scripts/tools to evaluate simulation results; and a video that describes how to get started with the design kit in the end user's environment.
"Our customers' ability to quickly design-in the Virtex II Pro Rocket IO technology is critical", said Rich Sevcik, Senior Vice President and General Manager of FPGA products at Xilinx.
"Working with Cadence, we are minimising the design-in time for our mutual customers, enabling customers to take advantage of dramatic system cost savings through the implementation of the serial technology in their next design".
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