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Product category: Electronics Manufacturing Machinery and Materials
News Release from: Blundell Production Equipment | Subject: IR500 and IR550
Edited by the Electronicstalk Editorial Team on 19 September 2003

Rework solutions for
virtually all PCB assemblies

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The IR500 and its big brother IR550 represent exceptional value for money while providing rework solutions to virtually all areas of PCB assembly, claims Blundell Production Equipment

The basic systems are exceptional at removal and replacement of BGAs, and can, without any additional equipment also handle virtually any size of QFP PLC or DIL. The patented shutter system enables heat to be directed on device to be reworked and precludes the necessity for expensive nozzles, and in addition, requires no access space around the device.

Topside and underside dark IR radiators operate at a specific frequency where absorption and reflection are virtually identical.

This means that regardless of component colour, surface finish or material, all the joints whether they are hidden, as in the case of BGA, or open as with most leaded devices, will be heated uniformly.

This is the only system that offers uniform heat distribution and because of this is the only system that guarantees BGAs will both self align and double drop in a controlled fashion.

In addition virtually all other surface mount components can be removed just as easily, safely and efficiently.

Due to the boosted underside heater, through-hole components up to 135mm square on the IR500, and 135 x 260mm in the case of the IR550, can be taken out and replaced at the same time, making for massive savings in time without the normal risk of damage to plated through hole.

The vacuum pickup can be set so as to ensure that there is no chance of damage to either board or device and the suction cup represents the only consumable part of the system.

The IR500 has an integral temperature monitor display connected to a semirigid K type thermocouple.

This can be easily located near the device, so that direct board temperature is monitored, removing the uncertainty allied to profiles that simply dictate predetermined nozzle or air temperature, neither of which tells you what is happening at board level.

The IR550 on the other hand does utilise profiles but in a rather unique way.

The system can either be operated using the optional K type thermocouple in the traditional way or there is an onboard noncontact infra-red temperature reader, either or both can be aligned to the profiler.

What is unique is the fact that users do not need an individual profile for each board, as once they have set the profile (recommend using the actual profile specified by the component manufacturer) the temperature readers drive the heaters to follow the set profile.

So it no longer matters whether the PCB is single layer, or 16 layer with heavy ground plane, as the actual temperature of the component and its surrounding footprint boosts or reduces power accordingly to the heaters, so as to follow the profile exactly.

There is also a multifunction solder station built in to both systems for all the smaller components such as chip capacitors and resistors which can be removed with heated tweezers and replaced using the fine tip micro soldering tool.

The highly acclaimed Tech tool and Power tools are also available for the more standard soldering jobs, making the IR500 and IR550 a more flexible rework centre than the most expensive alternative as well as being cheaper than those that can only handle single style devices.

As nearly three hundred users of the IR500 in the UK will verify, it is very simple and effective to use and requires little training to become proficient.

By the addition of the PL550 split vision alignment system the rework centre can accurately place fine pitch leaded devices, BGA, æBGA, flipchips or MLP's.

Even with this sophisticated addition the total package is well under the price of its nearest rival.

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