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Product category: IC and Hybrid Processing Equipment
News Release from: Accelonix (UK) | Subject: Laurier M9
Edited by the Electronicstalk Editorial Team on 01 December 2005
Die bonder delivers submicron resolution
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Designed to meet the needs of high accuracy bonding applications and specifically those of the optoelectronics and semiconductor industries, the Laurier M9 delivers submicron resolution.
Accelonix has added Laurier's ultra-high-precision flip-chip die bonder to its portfolio Designed to meet the needs of high accuracy bonding applications and specifically those of the optoelectronics and semiconductor industries, the M9 delivers submicron resolution (0.5 micron placement accuracy)
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