Product category: Heatsinks and Thermal Management
News Release from: The Bergquist Company | Subject: Sil-Pad 1500ST
Edited by the Electronicstalk Editorial Team on 17 March 2005
Insulating thermal interface
is naturally tacky
Bergquist's new Sil-Pad 1500ST electrically insulating thermal interface material provides exceptionally high thermal performance, even at contact pressures as low as 69kPa
Bergquist's new Sil-Pad 1500ST (soft tack) electrically insulating thermal interface material provides exceptionally high thermal performance, even at contact pressures as low as 69kPa. The material is designed to provide an electrically insulating interface between a power device and its heatsink.
This article was originally published on Electronicstalk on 17 March 2005 at 8.00am (UK)
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Glass-fibre-reinforced silicon-based thermal interface material is designed specifically for high-volume automatic dispensing applications
Sil-Pad 1500ST is inherently tacky on both sides, allowing it to be automatically dispensed and placed without the use of adhesives.
Sil-Pad 1500ST is an elastomeric material reinforced with glass fibre for resistance to cut-through.
Supplied in thicknesses of 0.2 and 0.3mm, it is designed for continuous use across a wide temperature range (-60 to +180C), providing a thermal conductivity of 1.8W/mK.
With a relative permittivity of 6.1 (at 1kHz) and volume resistivity of 100Gohm-m, Sil-Pad 1500ST provides electrical insulation in applications such as power supplies, automotive and motor control.
The ability of Sil-Pad 1500ST to wet out the surfaces to which it is applied - even at very low pressure - ensures its thermal performance is consistent across a wide range of contact pressures.
Bergquist supplies Sil-Pad 1500ST 8mil in roll form for auto dispensing.
Custom die-cuts are also available.
Sil-Pad 1500ST is the latest in Bergquist's extensive range of thermally conductive, electrically insulating Sil-Pad materials.
Like all Sil-Pad materials, Sil-Pad 1500ST provides a clean and efficient alternative to the use of mica, ceramics or grease in thermal management for electronic assemblies.
In particular, the use of Sil-Pad materials can eliminate the risk of cracking or breakage caused by the brittle nature of mica, which must be used in combination with grease to improve thermal conductivity.
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