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Software accelerates thermal simulations

A Blue Ridge Numerics product story
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Edited by the Electronicstalk editorial team Nov 2, 2006

Software enables users to set up and view a first-pass airflow and heat transfer simulation in minutes while generating high-fidelity design reviews up to 20 times faster than previous versions.

Blue Ridge Numerics has released a new version of its CFdesign software that enables users to set up and view a first-pass airflow and heat transfer simulation in minutes while generating high-fidelity design reviews up to 20 times faster than with previous versions.

CFdesign V9, developed for multitasking mechanical and thermal engineers, also offers new analysis features to increase innovation during electronic systems development.

CFdesign is used by electronics engineers worldwide to determine chip-junction temperatures in electronics devices, visualise and optimise airflow patterns in enclosures, generate detailed simulations of novel heatsink designs in real-world usage scenarios, test inlet and outlet louvres, hole patterns and hidden air vents, and place critical components in ruggedised systems.

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