Chip scale package line comes on-stream

Best Electronics and Components Company has successfully established a high volume chip scale package (CSP) production line.

Best Electronics and Components Company has successfully established a high volume chip scale package (CSP) production line.

The new CSP production line can electrically sort, laser mark, visually inspect, tape, and reel multiple wafer scale devices such as standard or bumped die as small as 0.5mm square and QFN packages at production volumes of 2 million devices per week.

Best's new CSP production line uses a totally inkless process based on an advanced wafer mapping program, developed by Best, that electronically merges bump maps, electrical sort maps, and vision inspection maps for all formats into one composite map that controls the selection and taping of all devices.

This inkless electronic mapping process eliminates unnecessary manufacturing operations, increases the quality level, and increases production throughput by 400%.

The new CSP production line features a punch-through tape that allows customers to remove die from either side of the finished tape.

"Our new CSP capability will enable Best to serve the rapidly expanding market for ultrasmall analogue and mixed signal integrated circuits used in cellphone, PDA and RFID applications", said Fred Kinder, President of Best Electronics.

"Best Electronics was able to integrate the new chip scale packaging service for our customers because we made the necessary capital investments in new equipment last year during the downturn".

"The centrepiece of our new CSP line is the high speed Ismeca WT-32 die inspection and tape and reel equipment".

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