Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Microchip Technology | Subject: PICmicro MCUs in MLF packages
Edited by the Electronicstalk Editorial Team on 8 February 2002
MCUs shrink to packages
half the size of SSOPs
Microchip's popular PICmicro OTP and Flash microcontrollers are now available in space-saving MicroLeadframe (MLF) packages that are 50% smaller than traditional SSOP alternatives
The elimination of conventional side leads and a near-chip-scale package improves board space efficiency, making these devices ideal for designs where space is at a premium. The MLF package also incorporates ExposedPad technology, exposing the die paddle that can be soldered directly to the printed circuit board.
This article was originally published on Electronicstalk on 8 February 2002 at 8.00am (UK)
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The new package simplifies manufacturing and reduces thermal limitations.
Die customers will find handling and wire-bonding issues to be non-existent and mounting and testing are made easier.
The first devices are available in 28-lead 6 x 6mm packages with a common pitch size of 0.65mm and competitively priced with typical SOIC devices.
These include four OTP devices (PIC16C62B, PIC16C63A, PIC16C72A and PIC16C73B) and two Flash devices (PIC16F73 and PIC16F76).
Additional devices in 8-, 20- and 40-lead packages are planned for later in the year.
Applications include handheld computers, PDAs, high-frequency wireless handsets, handheld measurement devices, small toys and various automotive applications, such as keyless entry or ignition systems.
Microchip offers several development tools that support the MLF devices.
The AC164031 adapter kit is also available now for the PICstart Plus and Pro Mate II development kits.
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