Product category: Heatsinks and Thermal Management
News Release from: Vero Electronics | Subject: Thermal management front panels
Edited by the Electronicstalk Editorial Team on 1 July 2005
Front panels enhance thermal management
New thermal management front panels ensure that the cooling airflow across the width of the chassis cannot take the path of least resistance up through any unused slot positions
Electronic Solutions has introduced two thermal management front panels to ensure that the cooling airflow across the width of the chassis cannot take the path of least resistance up through any unused slot positions. The 8U 6HP air management panels are supplied fully assembled, fitted with two quarter turn fasteners, a locating pin, a full depth base blanking plate, a dummy board and an EMC gasket to preserve screening integrity with the adjacent panel.
This article was originally published on Electronicstalk on 1 July 2005 at 8.00am (UK)
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Two versions are available: one is fitted with a steel solder side two cover; the other is not.
The covered version is intended for high-end applications where maximum cooling efficiency is needed.
It blocks off the low resistance path through which air needed to remove heat from the adjacent slot position could otherwise escape.
For less demanding applications where airflow restriction is not a critical issue, the steel cover is not fitted as a cost reduction measure.
Blank 6HP front panels, available with or without a steel solder side two cover are also available.
They are designed for use by board manufacturers as the front panel for their product or by system integrators for closing off unused slots.
A full customisation service is available to factory punch, silkscreen, engrave or fit graphic overlays to the panels for mounting I/O, switches and indicators in the specific configuration required for the application.
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