News Release from: Apache Design Solutions
Edited by the Electronicstalk Editorial Team on 14 June 2005
ATI commits to dynamic power integrity suite
Graphics processor specialist ATI Technologies has expanded its worldwide adoption of Apache's complete dynamic power integrity suite.
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Graphics processor specialist ATI Technologies has expanded its worldwide adoption of Apache's complete dynamic power integrity suite, including RedHawk-EV with PowerGate (low-power ramp-up analysis), NSpice-PI and recently announced PsiWinder. In a multi-million-dollar-per-year multi-year agreement, ATI will use Apache's products for dynamic power and timing signoff, as well as package-IC interface analysis. 'We found that Apache has a good vision of where the tools should be going and what kind of problems, we as designers, are facing and trying to address', said Simon Burke, Engineering Manager at ATI.
'We've been using RedHawk for more than a year on our most advanced production designs and we've been very pleased with its ability to accurately analyse the impact of dynamic voltage drop of our chips'.
'We're also impressed with Apache's ability to deliver robust and on-time solutions for our unique enhancement requests'.
'Moving forward, we will continue to work with Apache to broaden our deployment and address emerging challenges such as global I/O SSO', continued Burke.
'Recently, we evaluated PsiWinder for combined power and signal integrity critical path timing analysis, including the clock tree'.
'By using PsiWinder we were able to dramatically shorten and automate our Spice netlist extraction, setup, and simulation time'.
'This not only significantly increases the number of paths we can analyse per day but also improves our productivity'.
'Apache is excited that one of the leading fabless semiconductor companies such as ATI has placed their long-term trust in our technology and products', said Andrew Yang, CEO of Apache.
'Apache is a proven leader in dynamic power integrity with more than 150 dynamic tape-outs, and our solutions are well poised to address our customer's future design challenges'.
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