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Product category: Design and Development Software
News Release from: Ansoft Europe | Subject: SIwave v3
Edited by the Electronicstalk Editorial Team on 15 August 2005

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Ansoft Corp has upgraded its full-wave electromagnetic-field simulator optimised for signal- and power-integrity analysis of high-performance PCBs and IC packages

SIwave v3 provides expanded analysis capabilities for board and package codesign and EMI/EMC studies. Customers in the computer, semiconductor, networking, communications and high-performance consumer electronics industries benefit from the new release as it broadens the scope of simulation, more closely realises the complete system configuration and ultimately saves design time and cost as design respins are reduced.

SIwave's full-wave, finite-element technique allows designers to characterise simultaneous switching noise (SSN), intersymbol interference (ISI), power and ground bounce, resonances, reflections and coupling between traces and power/ground planes across the package and through the board.

With the inclusion of enhanced via modelling and package/board cosimulation, engineers are now able to more accurately characterise the entire PCB populated with IC packages.

New automation features streamline model and simulation setup while providing the necessary flexibility to readily analyse complex PCBs within SIwave.

Additionally, for chip-to-chip channel analysis, the new dynamic-link capability to Nexxim, Ansoft's next-generation, high-capacity circuit simulator, supports direct frequency- and time-domain analysis with Ibis or transistor-level accuracy from within Ansoft Designer or DesignerSI.

Far- and near-field data from SIwave can now be imported as a source driving HFSS v10, the industry-standard tool for 3D full-wave electromagnetic modelling.

Imported fields can be from a previously solved project, or SIwave can be launched directly from HFSS v10 to run an analysis and provide extracted data.

For example, SIwave and HFSS can now be combined to predict the electromagnetic radiation contained within, or escaping from, an enclosed space, such as computer housing related to the operation of high-speed complex PCBs.

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