Product category: Design and Development Software
News Release from: Ansoft Europe | Subject: Advanced Semiconductor Engineering IC Packaging so
Edited by the Electronicstalk Editorial Team on 8 November 2004
IC packaging partnership
proves a success
IC packaging leader Advanced Semiconductor Engineering has announced its commitment to Ansoft's HFSS, Q3D Extractor and AnsoftLinks simulation products for IC packaging design and model extraction
ASE's standardisation on Ansoft extends their existing investment and commitment to Ansoft solutions. "Demanding customers like IDM rely on ASE to provide leading-edge IC packaging solutions". "These customers require high-performance package designs that operate reliably up to Gigahertz frequencies", said Dr Sung-Mao Wu, Electrical Lab Manager at ASE.
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"We rely on Ansoft products to design these packages and ensure that the electrical performance requirements of our customers are met".
"The application of Ansoft tools arms us with the best solution and gives us an advantage over our competitors".
ASE uses HFSS, Q3D Extractor, TPA and AnsoftLinks to analyse complex high-speed and high-frequency packaging structures including quad flatpack (QFP), ball grid arrays (BGA), pin grid arrays (PGA) and chip scale packages (CSP).
Further reading
HFSS users to exchange experiences
Ansoft will hold its next UK HFSS Users Group meeting on Tuesday 19th June 2007 in Basingstoke, Hampshire
In addition, Ansoft products are used to design controlled impedance transmission lines, both single-ended and coupled, that exist within the packages.
Electrical models produced by Ansoft's software products are delivered to ASE's customers so that precise circuit performance can be determined prior to production.
Furthermore, optimisation of the package design can be performed in software to provide optimal system performance.
"We are very pleased to have a close partnership with ASE for IC package simulation and design", said Charles Lee, Country Manager/Director of Business Development for Ansoft Taiwan.
"This relationship drives us to continue to develop our electromagnetic technology in order to meet leading-edge packaging design requirements vital to ASE and their end customers".
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