News Release from: Ansoft Corporation Europe
Edited by the Electronicstalk Editorial Team on 7 June 2004
Collaboration marries IC and package design
Ansoft is working with Synopsys to provide streamlined IC and package codesign and analysis design flow solutions.
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Ansoft is working with Synopsys to provide streamlined IC and package codesign and analysis design flow solutions to address the substantial challenges of developing products based on 90nm and SoC technologies. "IC packaging is now in the critical path of silicon product delivery as package I/O counts and densities continue to skyrocket", said Kevin Rinebold, Sr. Technical Marketing Manager, Advanced Packaging Products, Synopsys.
"Increased functional integration, higher speed, and lower power drive the requirements for today's high-performance IC packages".
"Ansoft and Synopsys combine to provide a unique and automated package design and analysis solution to fill this evolving need".
For package designers, the ability to lay out the package and then seamlessly analyse the package interconnect structure for power and signal integrity issues is a major step forward in productivity and reliability of the end package design.
The combined solution offers a winning combination of Synopsys' package design tool, Encore, and Ansoft's signal integrity analysis products, TPA and SIwave.
The new Synopsys/Ansoft design flow for package design and analysis will debut at this year's Design Automation Conference (DAC) in San Diego, CA in the Ansoft booth 945.
With the combined tool solution offered by Synopsys and Ansoft, designers of I/O buffers, ICs and packages can now work concurrently from the same spec-sheet, using a common design flow, thereby streamlining the design process, saving both time and money.
"We are pleased to be partnering with the number-one player in EDA", said Sherry Hess, VP Marketing at Ansoft.
"Synopsys' leadership in design automation combined with Ansoft's physical design modelling and parasitic extraction solution delivers the integrated solution that IC and package designers require in order to stay ahead of their competition".
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