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Product category: Design and Development Software
News Release from: Ansoft Europe | Subject: SIwave
Edited by the Electronicstalk Editorial Team on 13 July 2001

High-speed analysis for
boards and IC packages

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SIwave from Ansoft is a novel tool designed to solve the power delivery and signal integrity problems prevalent in today's high-speed printed circuit boards and complex IC packages

SIwave from Ansoft is a novel tool designed specifically to solve the power delivery and signal integrity problems prevalent in today's high-speed printed circuit boards and complex IC packages. "Customer demand for greater functionality and higher performance electronics has resulted in designs with thousands of fast-switching I/Os", said Jonathan Smith, Product Marketing Manager, Signal Integrity Products.

"Being able to quickly analyse tradeoffs that affect both the power delivery and signal integrity of high speed designs has been missing in today's design flows, and has resulted in costly iterations and significant compromises in performance".

SIwave directly addresses these problems.

Using a novel approach based on a hybrid, full-wave, finite element technique, engineers can now characterise simultaneous switching noise, power and ground bounce, resonances, reflections, and coupling between traces and power/ground planes.

SIwave solves the entire design in one simulation, saving hours and sometimes days over existing modelling and simulation techniques.

SIwave can analyse complex circuit designs consisting of multiple, arbitrarily shaped power and ground layers and any number of vias and signal traces.

Simulation results are reported graphically with advanced 3D visualisation.

Furthermore, SIwave can generate equivalent circuit models so users of commercial Spice can continue to get the benefit of full-wave techniques without having to use a proprietary simulator.

Signal integrity effects that can be modelled include: resonance frequencies of complete power and ground structures with decoupling capacitors; power and ground bounce; simultaneous switching noise; impedance discontinuities due to changes in signal layers or split supply planes; noise coupling between signal lines and supply planes; complicated crosstalk effects between distant signal traces; time-domain effects such as propagation delay, rise and fall times, reflections and ringing; and frequency-domain phenomena such as resonant modes and S-parameters.

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