High density, hot-swap power solutions

Product category: Communications ICs (Wireless)
News Release from: AMI Semiconductor | Subject: ASTRIC
Edited by the Electronicstalk Editorial Team on 23 July 2002

Platform provides low power radio SoCs

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A new mixed-signal RF ASIC technology offers to significantly reduce the system cost, power consumption, form factor and time to market of short-range low-datarate wireless applications

A new mixed-signal RF ASIC technology platform from AMI Semiconductor delivers SoC solutions that significantly reduce the system cost, power consumption, form factor and time to market of short-range low-datarate wireless applications. AMIS has tapped into over 30 years experience as a technology leader in mixed-signal ASICs, particularly in the low-datarate RF arenas, to deliver the ASTRIC (application specific transmit and receive IC) mixed-signal RF ASIC technology to designers of wireless products and systems.

Offering an attractive alternative to more complex and more expensive Bluetooth solutions, the new AMIS ASTRIC technology provides a scalable path for integrating board-level and modular transmitter, receiver and transceiver applications into true SoC implementations.

ASTRIC solutions are ideally suited to licence-free one-way and two-way wireless designs that require datarates of up to 40Kbit/s over distances under 100m.

As a result, target data applications will include telemetry, security systems, medical monitoring, interactive toys, intelligent agriculture and remote vehicular products.

Traditionally, these applications, which do not require the complexity of Bluetooth solutions, have been based around board-level and modular transmitter, receiver and transceiver designs.

Discussing the ASTRIC technology, Bob Klosterboer, vice president of Mixed-signal ASICs at AMIS, states: "The ASTRIC mixed-signal RF ASIC technology platform provides manufacturers of low data rate wireless applications reduced system cost, smaller form factors, lower power consumption and faster time to market, as well as enhanced reliability and improved product security".

He adds: "We see custom products based on the ASTRIC technology coexisting with and complementing existing Bluetooth products by meeting the needs of applications where the complexity of Bluetooth is not applicable or the cost would be prohibitive".

Based around a highly integrated 0.35-micron CMOS process that features up to five metal layers, ASTRIC SoC designs can use many AMIS analogue and digital IP building blocks to reduce development time and effort.

These blocks include solutions for clock management and power management, analogue front ends, and interface macros for USB, PCI and I2C functionality.

Embedded microcontroller options include 8051, 6502, Z80 and ARM7 cores, while embedded memory solutions feature ROM, EEPROM, and single- and dual-port SRAM.

(This was Electronicstalk's Top Story on 23 July 2002)

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