Product category: Plugs and Sockets
News Release from: Advanced Interconnections Corp | Subject: Hybrid socket adapter
Edited by the Electronicstalk Editorial Team on 24 January 2007
Hybrid adapter offers low
attenuation up to 3.5GHz
Hybrid socket adapter design uses both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints
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Advanced Interconnections Corp now offers a hybrid socket adapter design that uses both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints. The patented design features the reliability of screw-machined terminals with multiple-finger contacts in a compact SMT socket.
At only 2.00mm larger than the device package, with no external hold-downs required, this innovative system is designed for development and validation of BGA and LGA devices, production level socketing and SMT board-to-board connector applications.
The new hybrid socket adapter design offers very low signal attenuation up to 3.5GHz, and features standard eutectic tin/lead solder balls or new lead-free tin/silver/copper solder ball terminals for RoHS compliant applications.
Unique alignment pins protect the pin field and aid in hand placement with optional standoffs available..
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