News Release from: Advanced Interconnections Corp
Subject: B2B high density SMT connectors
Edited by the Electronicstalk Editorial Team on 28 August 2006
Connectors promise reliable board stacking
High density SMT connectors offer the industry's most robust solution for 1.27mm pitch surface mount board stacking applications.
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The new line of B2B high density SMT connectors from Advanced Interconnections Corp offers the industry's most robust solution for 1.27mm pitch surface mount board stacking applications. The B2B connector line employs screw-machined terminals with multiple finger contacts and the company's exclusive solder ball terminal design, field-proven for superior reliability and processing results. With a current rating of 3A per pin, more contacts can be assigned to data/signal transfer (fewer pins are sacrificed for power/earth).
These high quality terminals, coupled with a completely redesigned precision moulded LCP insulator, offer a more rugged and durable contact system which is better suited for blind mating applications.
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