Product category: Plugs and Sockets
News Release from: Advanced Interconnections Corp | Subject: Flip-Top BGA socket
Edited by the Electronicstalk Editorial Team on 11 May 2006
BGA socket offers lead-free option
Advanced Interconnections Corp has launched its next generation Flip-Top BGA socket
Designed for development, test and validation of 1.00mm pitch BGA and LGA devices at speeds up to 2.6GHz (single-ended), the compact design requires no soldering of the IC and needs no external hold-downs or tooling holes in the PC board. The new series is available for either through-hole or surface mount applications.
Unique features include solder ball terminals (traditional Sn/Pb or new lead-free Sn/Ag/Cu), an integral finned heatsink or coin screw, and patented spring pin technology that matches the device footprint.
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