News Release from: Advanced Interconnections Corp
Subject: Flip-Top BGA socket
Edited by the Electronicstalk Editorial Team on 4 June 2003
Novel BGA socket cuts real estate
The Flip-Top BGA socket dramatically reduces PC board space for BGA and LGA device socketing in development, test and production applications.
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The Flip-Top BGA socket dramatically reduces PC board space for BGA and LGA device socketing in development, test and production applications. The compact design features exclusive eutectic solder ball terminals and patented True BGA socket design. The Flip-Top BGA socket is available in virtually any 1.27mm-pitch footprint and features gold-plated terminals and contacts with an integral, finned heatsink or coin screw retention clamp.
Other features include: no external retention or device soldering is necessary; the socket is only 3mm wider and 10mm longer than the BGA device; the approximate height without heatsink is just 17mm from the PC board; the socket conforms to industry standard coplanarity; and both solder ball and solder tail terminals are available.
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