Week 4 January - 10 January 2009
Showing 1 - 10 of 43 articles
Molex DDR cable assemblies improve signal quality
Molex has developed DDR cable assemblies that it says increase systems speeds while improving signal quality and lowering overall costs.
News from Molex UK, 9 January 2009
Mornsun America launches 6W DC/DC convertors
Mornsun America has introduced the WRA YMD and WRB YMD series of 6W DC/DC convertors designed to combine economical pricing with a compact size and high-performance features.
News from Mornsun America LLC, 9 January 2009
Load switches minimise quiescent current
The FPF2024, FPF2025, FPF2026 and FPF2027 are Intellimax load switches that minimise the quiescent current and prolong battery life.
News from Fairchild Semiconductor, 9 January 2009
AAC software supports Via licensing program
The Fraunhofer Institute for Integrated Circuits's (IIS) complete suite of Advanced Audio Coding (AAC) software is available to support the AAC patent licensing program from Via Licensing.
News from Fraunhofer Institute for Integrated Circuits IIS, 9 January 2009
Apache launches Redhawk-NX
Apache Design Solutions has announced the launch of Redhawk-NX, a power integrity solution re-architected to handle designs of five hundred million gates.
News from Apache Design Solutions, 9 January 2009
LTC2631 DACs come in small package
Linear Technology has introduced the LTC2631, a family of pin- and software-compatible 12-bit, 10-bit and 8-bit DACs in a compact TSOT-23 package.
News from Linear Technology Corp, 9 January 2009
Further information availableLow-power data acquisition system launched
Maxim Integrated Products has introduced the MAX1329, a low-power data acquisition system that integrates precision data convertors for signal conditioning and sensor excitation.
News from Maxim Integrated Products, 9 January 2009
Harting to showcase interconnection products
At Southern Electronics 2009 the Harting Technology Group will be featuring its range of electrical and electronics interconnection solutions.
News from Harting, 9 January 2009
Aries announces CSP/Ballnest hybrid socket
Aries Electronics has announced its CSP/Ballnest hybrid socket suitable for prototyping, test or burn-in of chip scale package, BGA (ball grid array), MicroBGA and LGA (land grid array) devices.
News from Aries Electronics, 9 January 2009
Fluke releases v3.4 of Flukeview Forms
Fluke Corporation has released an enhanced version 3.4 of Flukeview Forms, its analysis and reporting software for digital multimeters (DMMs) and other test instruments.scription
News from Fluke (UK), 9 January 2009
Not what you're looking for? Search the site.
Featured articles
- Schroff Card-Lok can be compressed from both ends
The Series 236 Card-Lok from Schroff incorporates a dual-thread design that allows the device to be compressed from both ends by turning a single screw. - Linear unveils triple-output DC/DC uModule
Linear Technology has introduced the LTM4615, a complete triple-output DC/DC uModule regulator system.
Browse by category
- Active components (13556)
- Passive components (3584)
- Design and development (10248)
- Enclosures and panel products (3983)
- Interconnection (3643)
- Electronics manufacturing, packaging (3484)
- Industry news (2106)
- Optoelectronics (1959)
- Power supplies (3009)
- Subassemblies (5623)
- Test and measurement (5784)
