Week 18 May - 24 May 2008
Showing 1 - 10 of 99 articles
4G chipset to provide multiple broadband options
User Application Article
The Odyssey 8500 chipset will be adapted to support the XG-PHS standard and Willcom's advanced requirements for the Japanese marketplace.
News from Wavesat, 23 May 2008
Water-cooled supplies boost power density
Power supplies integrate semiconductor chillers and air to water heat exchangers to manage cooling of heat producing components.
News from Magna-Power Electronics, 23 May 2008
Product safety standards online
Safety Link provides ready access to the world's electrical product safety approval test labs, standards bodies and government organisations.
News from Product Safety International, 23 May 2008
Development platform eases the learning process
NI Elvis II gives educators 12 new USB plug-and-play instruments and complete integration with Multisim 10.1 software for Spice simulation.
News from National Instruments, 23 May 2008
Further information availableDipping paste handles significant warping
Almit's LFM 48N dipping paste is ideal for holding larger area devices that often exhibit warping during reflow.
News from Almit Technology, 23 May 2008
Design environment simplifies wafer mask building
GTmask is built upon Xyalis' wafer floorplanning and assembly tool (GTmuch), a proven solution able to place hundreds of chips in minutes.
News from Xyalis, 23 May 2008
Certification provides guaranteed quality
Indium's newest facility joins the company's US, English, Chinese and Singapore operations in achieving ISO9001:2000 certification.
News from Indium Corporation of America, 23 May 2008
Vented enclosures ease heat management
The vented CNMB/12 snapfit DIN rail enclosure is 210mm long and features ventilation slots moulded into both sides of the body to provide improved heat dissipation.
News from Camden Electronics, 23 May 2008
Tiny image sensor suits mobile phone use
The MC501EA also provides low-noise 10bit ADC and scene adaptive control, noise filtering, colour processing and edge enhancement, resulting in crisp, true-colour images.
News from MagnaChip Semiconductor, 23 May 2008
Shrink to 40nm increases FPGA capabilities
The Stratix IV family has up to 680K logic elements, 2x bigger than Altera's Stratix III family, which currently comprise currently the largest FPGAs on the market.
News from Altera Europe, 23 May 2008
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Featured articles
- Power interconnects make better use of airflow
Tyco Electronics has developed a range of power interconnects, comprising the Multi-Beam XLE and Minipak HDL connectors, to meet the demand for increased current density with modular power solutions. - Tyco Electronics launches miniature trunk cable
Tyco Electronics has launched a Madison Cable brand Category 5E miniature trunk cable designed for the telecommunication and data communication industries.
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