Week 3 February - 9 February 2008
Showing 1 - 10 of 123 articles
Lead-free solder wire is kind to tips
No-clean cored solder wire is developed for manufacturers who do not require silver in lead-free materials.
News from Almit Technology, 8 February 2008
Big NAND Flash shrinks to 43nm process
New 16Gbit products have a chip area less than 70% that of same-density NAND Flash memories fabricated with 56nm process.
News from Toshiba Electronics Europe, 8 February 2008
Step-down regulator handles automotive extremes
The LT3500 runs from an input voltage range of 3 to 36V (40V maximum), making it ideal for load dump and cold-crank conditions found in automotive applications.
News from Linear Technology Corp, 8 February 2008
Further information availableLinux development platform makes the carrier grade
First Linux distribution for the networking and telecommunications industries that adheres to the most recent Carrier Grade Linux specification.
News from Wind River Systems, 8 February 2008
Chipsets upgrade for the long term
Multimode Mobile Data Modem chipsets deliver significant flexibility to the industry by supporting LTE, as well as other 3GPP and 3GPP2 standards.
News from Qualcomm, 8 February 2008
Digitisers and DMM expand USB modules
Compact lightweight instruments are ideal for portable, benchtop and OEM applications.
News from National Instruments, 8 February 2008
Guides shed light on capacitive switches
User Application Article
Illuminating capacitive switches has traditionally caused problems to designers as the electric field from the light source affects the operation of the switch.
News from Design LED Products, 8 February 2008
Lead-free lenses maintain performance
Using lead-free glass with a different reflection index and transition point, Alps has created lenses that are equivalent to existing products in terms of shape, specifications and price.
News from Alps Electric (UK), 8 February 2008
Rep deal brings Cswitch to Europe
Cswitch will be represented throughout Europe by Spectrum's pan-European rep/stockist operation, Silicon Design.
News from Spectrum Group, 8 February 2008
Quiet coolers keep latest processors in spec
Processor coolers combine heatsink structure with heat pipes that require only little airflow to perform, thereby keeping the noise level at a bare minimum.
News from Nexus Technology, 8 February 2008
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Featured articles
- Linear unveils triple-output DC/DC uModule
Linear Technology has introduced the LTM4615, a complete triple-output DC/DC uModule regulator system. - Power interconnects make better use of airflow
Tyco Electronics has developed a range of power interconnects, comprising the Multi-Beam XLE and Minipak HDL connectors, to meet the demand for increased current density with modular power solutions.
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