Visit the Fujitsu Components Europe web site

Week 30 September - 6 October 2007

Showing 1 - 10 of 102 articles

Design service eases EMI screening

Tecan offers tailored design solutions from multi-cavity structures to standard or customised enclosures.

News from Tecan, 5 October 2007

Alliance brings new RTOS to SBC

The LynxOS 4.2 real-time operating system (RTOS) board support package (BSP) will be available on Curtiss-Wright's SVME/DMV-183 single board computer (SBC)

News from LynuxWorks, 5 October 2007

Firmware aids debugging

Ronetix' JTAG/BDM emulator and flash programmer firmware supports the debugging and Flash programming of TI DM644x DaVinci processors.

News from Ronetix, 5 October 2007

Small datalogger aids thermal profiling

The datalogger attaches by way Solderstar's Smartlink system to a range of adapters which provide between six and 16 measurement channels in a variety of configurations.

News from SolderStar, 5 October 2007

Compact IC minimises voltage changes

Allegro MicroSystems' A3903 has a typical input voltage range of 3 to 5.5V and produces an output current up to 500mA.

News from Allegro MicroSystems Europe, 5 October 2007

Silver conductor pastes suit solar cells

The D-110, D-112 and D-114 silver conductor pastes are targeted at display bus bar electrodes.

News from Five Star Technologies, 5 October 2007

Cabinets provide space for cabling

Schroff Varistar Server cabinets offer a spacing of 740mm between front and rear panel mounts, with a 120mm gap at the front for patch cables and a 340mm gap at the rear for power and data cables.

News from Schroff UK, 5 October 2007

Further information available

Showing 1 - 10 of 102 articles

Back to 'News by month'

Not what you're looking for? Search the site.

Linear unveils triple-output DC/DC uModule

Linear Technology has introduced the LTM4615, a complete triple-output DC/DC uModule regulator system.
Power interconnects make better use of airflow

Tyco Electronics has developed a range of power interconnects, comprising the Multi-Beam XLE and Minipak HDL connectors, to meet the demand for increased current density with modular power solutions.