
Week 29 July - 4 August 2007
Showing 1 - 10 of 112 articles
Chemicals makers chase PCB production
Growing replacement of PCBs in several industrial applications has led to decreased usage.
News from Frost and Sullivan, 3 August 2007
Conformance tests claim comprehensive coverage
Anite now provides the most comprehensive offering for testing the HSDPA and HSUPA protocols of next-generation mobile devices.
News from Anite Telecoms, 3 August 2007
Chargers secure DC supplies
Linear battery chargers provide high reliability and and low electromagnetic emissions, making them ideal components for uninterruptible DC supplies.
News from Devlin Electronics, 3 August 2007
Greener coating passes machine trials
User Application Article
Specialist manufacturer of high quality automated and manual adhesive dispensing and selective spray coating equipment evaluates water-based conformal coating.
News from Electrolube, 3 August 2007
Low-cost MCUs handle up to 24 I/Os
Small-memory MCUs have up to 24 high-sink-current I/O lines, in combination with the well established ST7Lite feature set.
News from STMicroelectronics, 3 August 2007
Three-channel driver optimises LED performance
Intelligent and power efficient LED drivers offer a significant advantage to solid-state lighting manufacturers that are serious about reducing the carbon footprint of their ranges.
News from Integrated System Technologies, 3 August 2007
Desktop processor makes low-cost PC more frugal
User Application Article
Systemax Manufacturing has used the 1.5GHz VIA C7-D desktop processor in its new highly energy efficient PC for the US market.
News from VIA Technologies, 3 August 2007
DC/DC combo is optimised for mobile power
The D1000 modular power solution from Powerstax offers up to 1000W of DC power from vehicle or other mobile or static DC power sources.
News from Powerstax, 3 August 2007
Shenzhen plant to play major global role
A new state-of-the-art manufacturing facility in Shenzhen is expected to account for 50% of DEK's total worldwide production by the end of 2007.
News from DEK, 3 August 2007
Smaller image sensors hit the street
Tenth-inch VGA CameraChip sensor offers a cost-effective ultrathin camera module solution for entry-level camera phones as well as for secondary cameras in 3G handsets.
News from OmniVision, 3 August 2007
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Featured articles

- Teseq releases PMM 9010/30P EMI receiver/analyser
Teseq is offering a digital EMI receiver/analyser with optimum measurement parameters for EMC labs that do not require full CISPR compliance for radiated emissions measurements. - Schroff Card-Lok can be compressed from both ends
The Series 236 Card-Lok from Schroff incorporates a dual-thread design that allows the device to be compressed from both ends by turning a single screw.

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