
Week 8 April - 14 April 2007
Showing 1 - 10 of 212 articles
Foundry offers support services for 45nm process
A full range of design support services for foundry's 45nm process includes prototyping
News from TSMC, 13 April 2007
Framework helps develop mobile phone handsets
Lenovo Mobile has chosen the Sasken Communication Technologies' Application Framework as its application system of choice for development of feature phones.
News from Sasken Communication Technologies, 13 April 2007
First round of funding closed
Venture capitalist has announced the successful first close of over US $1 million funding for M2FX plc.
News from Miniflex, 13 April 2007
Flormerics' software reduces time to market
An independent survey found that users of thermal-analysis software have over 40% fewer respins on average per printed circuit board (PCB) design than non-users.
News from Flomerics, 13 April 2007
High density SRAM for system on chip
User Application Article
A large amount of embedded memory on a competitively priced consumer-oriented SoC will enhance the real-time conference-calling capabilities of mobile phones.
News from MoSys, 13 April 2007
EDA companies combine to improve mask consistency
A specialist in variability-aware analysis, and a provider of mask-reconfigurable technology, are to combine their expertise to reduce litho-related and stress-related variability in masks.
News from Clear Shape Technologies, 13 April 2007
Global distribution for interconnection specialist
Electronic component distributor Digi-Key Corporation and JAE Electronics have signed a global distribution agreement.
News from Digi-Key Corporation, 13 April 2007
Systems case has RFI shielding
A new version of the existing Propac systems case has good RFI shielding to protect sensitive electronics and includes four ventilation grills in the base plate for effective thermal management.
News from Schroff UK, 13 April 2007
Miniature push/pull connectors made of brass
A series of locking miniature push/pull connectors are machined from brass to provide an increased mechanical durability compared to traditional aluminium connectors.
News from PEI-Genesis, 13 April 2007
Bride links PCI bus to AMbA
A PCIE 2 AMBA AXI bridge is to be used in a system-on-chip (SOC) design for consumer applications.
News from GDA Technologies, 13 April 2007
Not what you're looking for? Search the site.
Featured articles

- Synchronous buck regulator targets Li-Ion apps
Linear Technology's LTC3616 high-efficiency, 4MHz synchronous buck regulator is ideal for single-cell Li-Ion applications, as well as 3.3 or 5V intermediate bus systems. - TDK-Lambda announces 60W PXF DC-DC converter
TDK-Lambda EMEA has introduced a 60W model into its PXF range of DC-DC converters for datacom, telecom, instrumentation and test and measurement applications.

Browse by category
- Active components (13556)
- Passive components (3584)
- Design and development (10248)
- Enclosures and panel products (3983)
- Interconnection (3643)
- Electronics manufacturing, packaging (3484)
- Industry news (2106)
- Optoelectronics (1959)
- Power supplies (3009)
- Subassemblies (5623)
- Test and measurement (5784)