Product category: Power Supply ICs and Controllers
News Release from: Zetex | Subject: Generation 5
Edited by the Electronicstalk Editorial Team on 16 January 2004
Novel bipolar technology cuts saturation
voltage
A new generation of bipolar transistors from Zetex offers a 30% improvement in saturation voltage compared with previous generations.
A new generation of bipolar transistors from Zetex offers a 30% improvement in saturation voltage compared with previous generations The enhanced performance of the Generation 5 transistors comes as a result of reductions in component resistance, achieved through advances in material technology and processing techniques
This article was originally published on Electronicstalk on 6 Feb 2002 at 8.00am (UK)
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Aimed at general low to medium voltage switching applications, the Generation 5 bipolars will meet the demands of a wide range of applications including battery charging, motor control, FET driving and resonant converters.
Generation 5 technology will optimise the performance of existing Zetex large area die types and offer improved efficiency and power levels and in some instances, a reduction in PCB space requirements.
Ten Generation 5 transistors are initially planned, covering a voltage range from 20 to 140V.
Package types will include SOT89, "large flag" SOT23 and SOT223.
The range of SOT223 devices will include four NPN transistors (25-100V, Ic up to 7A) and four PNP transistors (30-140V, Ic up to 5.5A).
Zetex' Power Management Group Manager Jos Van Loo said: "Our Generation 5 products demonstrate once more the tremendous advantage bipolar technology still holds over mosfet technology in many low to medium voltage applications.
This is just one more stage in an exciting product road map that promises a very bright future for bipolars".
He continued: "Our future benchmark developments include a Generation 6 platform, currently in progress and a Generation 7 platform, which is at the feasibility stage.
Both platforms aim to further increase bipolar capabilities through a combination of innovative die processing and optimised packaging techniques".
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