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Product category: Analogue and Mixed Signal ICs
News Release from: Xemics | Subject: XE3005
Edited by the Electronicstalk Editorial Team on 16 June 2003
Codec shrinks to chip-scale packaging
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The XE3005 low-power codec is now available in an Ultra CSP chip-scale package.
The XE3005 low-power codec is now available in an Ultra CSP chip-scale package The Ultra CSP is a true wafer level packaging technology using standard equipment to produce a thin-film, solderable redistribution layer
This article was originally published on Electronicstalk on 19 Dec 2001 at 8.00am (UK)